The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Apr. 04, 2012
Applicants:

Anne Ripert, Marseilles, FR;

Pierre Volpe, Auriol, FR;

Yves-pierre Cuenot, La Ciotat, FR;

Guillaume Henaut, Gardanne, FR;

Inventors:

Anne Ripert, Marseilles, FR;

Pierre Volpe, Auriol, FR;

Yves-Pierre Cuenot, La Ciotat, FR;

Guillaume Henaut, Gardanne, FR;

Assignee:

SMART PACKAGING SOLUTIONS (SPS), Zi de Rousset, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); G06K 19/077 (2006.01); G06K 19/02 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07749 (2013.01); G06K 19/025 (2013.01); Y10T 29/49018 (2015.01);
Abstract

A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.


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