The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Oct. 18, 2013
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Chaode Mo, Shenzhen, CN;

Chunliang Lee, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/38 (2012.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); G03F 1/44 (2012.01); G03F 1/42 (2012.01); G02F 1/1339 (2006.01); G03F 1/00 (2012.01); G02F 1/13 (2006.01);
U.S. Cl.
CPC ...
G03F 7/16 (2013.01); G02F 1/1339 (2013.01); G03F 1/00 (2013.01); G03F 1/38 (2013.01); G03F 1/42 (2013.01); G03F 1/44 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); G02F 1/1303 (2013.01); G02F 2202/28 (2013.01);
Abstract

The present invention provides a method for manufacturing a light-shielding mask for curing a sealant, including the following steps: step: providing a transparent substrate (); step: sequentially forming a metal layer () and a photoresist layer () on the transparent substrate (); Step: carrying out exposure on an edge of the photoresist layer () to form an inspection mark (); step: subjecting the photoresist layer () to exposure along a predetermined trace by adopting an edge exposure process, wherein the predetermined trace corresponds to a predetermined trace of a sealant to be formed in a liquid crystal display panel; step: removing the exposed portion of the photoresist layer () to expose the metal layer (); step: subjecting the exposed portion of the metal layer () to etching and removing the unexposed portion of the photoresist layer (); and step: forming a transparent protection layer () on the metal layer () and the transparent substrate (). The present invention uses an edge exposure process to achieve exposure of the photoresist layer so that no specific masking plate is needed and the number of masking plates prepared can be effectively reduced, thereby reducing the cost the material for manufacture.


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