The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jan. 21, 2014
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Satoshi Nakajima, Okaya, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); G01P 1/02 (2006.01); G01L 19/00 (2006.01); G01P 15/125 (2006.01); B81C 1/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
G01P 1/023 (2013.01); B81C 1/0023 (2013.01); G01L 19/00 (2013.01); G01P 15/125 (2013.01); H01L 23/3121 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); B81B 2201/0235 (2013.01); B81B 2203/0136 (2013.01); B81B 2207/012 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 25/16 (2013.01); H01L 2224/16195 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92127 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); Y10T 156/10 (2013.01);
Abstract
A sensor includes: a substrate on which an active chip including a semiconductor circuit is disposed; and a passive chip including an acceleration sensor, and a thick portion and a thin portion, the thick portion being disposed on the substrate so as to be in contact therewith. An active chip terminal is disposed on the active chip. A passive chip terminal is disposed on the passive chip at the thin portion. The passive chip terminal and the active chip terminal face each other and are connected via a bump.