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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9255747 B1

PDFFull Text
Date of Patent:
Feb. 09, 2016

Filed:

Oct. 16, 2014

Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Asumi Jindo, Okazaki, JP;

Katsuhiro Inoue, Ama-Gun, JP;

Yuji Katsuda, Tsushima, JP;

Takashi Kataigi, Handa, JP;

Shingo Amano, Chita-Gun, JP;

Hiroya Sugimoto, Chiryu, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Jonathan Langman

Int. Cl.
CPC ...
B23K 31/02 (2006.01); C04B 35/653 (2006.01); B32B 9/06 (2006.01); B32B 15/04 (2006.01); B32B 15/00 (2006.01); F28F 7/00 (2006.01); F28D 15/00 (2006.01); F28F 3/12 (2006.01); C04B 35/565 (2006.01); C04B 35/645 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); C04B 35/56 (2006.01); C04B 35/58 (2006.01); C04B 37/00 (2006.01); F28F 21/08 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
F28F 3/12 (2013.01); B23K 1/0008 (2013.01); B23K 1/19 (2013.01); C04B 35/565 (2013.01); C04B 35/5611 (2013.01); C04B 35/5615 (2013.01); C04B 35/58092 (2013.01); C04B 35/645 (2013.01); C04B 37/006 (2013.01); F28F 21/086 (2013.01); H01L 21/6833 (2013.01); C04B 2235/3839 (2013.01); C04B 2235/3843 (2013.01); C04B 2235/3891 (2013.01); C04B 2235/404 (2013.01); C04B 2235/428 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/72 (2013.01); C04B 2235/77 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); Y10T 428/249969 (2015.04);
Abstract

A member for a semiconductor manufacturing apparatus includes an alumina electrostatic chuck, a cooling plate, and a cooling plate-chuck bonding layer. The cooling plate includes first to third substrates, a first metal bonding layer between the first and second substrates, a second metal bonding layer between the second and third substrates, and a refrigerant path. The first to third substrates are formed of a dense composite material containing Si, SiC, and Ti. The metal bonding layers are formed by thermal compression bonding of the substrates with an Al—Si—Mg or Al—Mg metal bonding material interposed between the first and second substrates and between the second and third substrates.

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