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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9255514 B1

PDFFull Text
Date of Patent:
Feb. 09, 2016

Filed:

Mar. 25, 2014

Honeycomb structure

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Yoshimasa Omiya, Nagoya, JP;

Atsushi Kaneda, Nagoya, JP;

Kazumi Mase, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Amber R Orlando

Int. Cl.
CPC ...
B01D 50/00 (2006.01); B01D 39/14 (2006.01); B01D 39/06 (2006.01); B01D 39/20 (2006.01); B01D 24/00 (2006.01); F01N 3/28 (2006.01); C04B 35/565 (2006.01); C04B 37/00 (2006.01); C04B 38/00 (2006.01); B01D 46/24 (2006.01); F01N 3/20 (2006.01);
U.S. Cl.
CPC ...
F01N 3/2803 (2013.01); B01D 46/2425 (2013.01); B01D 46/2448 (2013.01); C04B 35/565 (2013.01); C04B 37/005 (2013.01); C04B 38/0019 (2013.01); F01N 3/2026 (2013.01); F01N 3/2828 (2013.01); F01N 2330/06 (2013.01);
Abstract

A honeycomb structure includes a tubular bonded honeycomb segment assembly having a plurality of honeycomb segments and a bonding layer which bonds side surfaces of the plurality of honeycomb segments to each other; and a pair of electrode members disposed on a side surface of the bonded honeycomb segment assembly, a volume resistivity of each of the honeycomb segments is from 1 to 200 Ωcm, at least a part of the bonding layer is made of a bonding material having a conductivity, a volume resistivity of the bonding layer is from 2 to 2000 Ωcm, and each of the pair of electrode members is formed into a band-like shape extending in an extending direction of the cells of the bonded honeycomb segment assembly, and one electrode member is disposed on a side opposite to the other electrode member via a center of the bonded honeycomb segment assembly.

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