The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Apr. 08, 2009
Applicants:

John Hewitt Liversage, Springs, SA;

Iain Patrick Goudemond, Springs, SA;

Danny Eugene Scott, Montgomery, TX (US);

Inventors:

John Hewitt Liversage, Springs, SA;

Iain Patrick Goudemond, Springs, SA;

Danny Eugene Scott, Montgomery, TX (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B29C 65/02 (2006.01); C22C 26/00 (2006.01); B01J 3/06 (2006.01); B22F 7/06 (2006.01); C04B 35/52 (2006.01); C04B 35/573 (2006.01); C04B 35/645 (2006.01); C04B 37/02 (2006.01);
U.S. Cl.
CPC ...
C22C 26/00 (2013.01); B01J 3/065 (2013.01); B22F 7/062 (2013.01); C04B 35/52 (2013.01); C04B 35/573 (2013.01); C04B 35/645 (2013.01); C04B 37/021 (2013.01); C04B 37/026 (2013.01); B01J 2203/0655 (2013.01); C04B 2235/427 (2013.01); C04B 2237/122 (2013.01); C04B 2237/123 (2013.01); C04B 2237/363 (2013.01); C04B 2237/365 (2013.01); C04B 2237/704 (2013.01); C22C 2204/00 (2013.01); Y10T 156/10 (2015.01); Y10T 428/30 (2015.01);
Abstract

A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.


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