The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jan. 10, 2006
Hiromitsu Kuroda, Hitachi, JP;
Kazuma Kuroki, Hitachinaka, JP;
Seigi Aoyama, Kitaibaraki, JP;
Hiroyoshi Hiruta, Kitaibaraki, JP;
Hiromitsu Kuroda, Hitachi, JP;
Kazuma Kuroki, Hitachinaka, JP;
Seigi Aoyama, Kitaibaraki, JP;
Hiroyoshi Hiruta, Kitaibaraki, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt·ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 μm or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 μm or less.