The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jun. 04, 2010
Takeshi Sakurai, Aizuwakamatsu, JP;
Yoshihiro Kameyama, Aizuwakamatsu, JP;
Yoshio Abe, Aizuwakamatsu, JP;
Takeshi Sakurai, Aizuwakamatsu, JP;
Yoshihiro Kameyama, Aizuwakamatsu, JP;
Yoshio Abe, Aizuwakamatsu, JP;
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Abstract
A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm, and a bending elastic limit value is 472 to 503 N/mm.