The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Aug. 25, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Hiroaki Mihara, Machida, JP;

Etsuko Sawada, Tokyo, JP;

Shoji Shiba, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 15/18 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1629 (2013.01); B41J 2/1603 (2013.01); B41J 2/1628 (2013.01); B41J 2/1631 (2013.01); B41J 2/1639 (2013.01); B41J 2/1645 (2013.01);
Abstract

A process for producing a liquid ejection head including a silicon substrate having a supply port to supply a liquid to a flow path, and an ejection-orifice-forming member forming the flow path between the ejection-orifice-forming member and the silicon substrate and having an ejection orifice to eject the liquid in the flow path. The process includes forming an etching protection film so as to cover the ejection-orifice-forming member; forming the supply port passing through the silicon substrate by anisotropic etching using an alkaline aqueous solution; and removing the etching protection film. The etching protection film includes an organic polymer material having a storage modulus at 80° C. of 1.0×10Pa or higher.


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