The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

May. 31, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kazuhiro Yamada, Yokohama, JP;

Shuzo Iwanaga, Kawasaki, JP;

Ryohei Goto, Fujisawa, JP;

Takatsugu Moriya, Tokyo, JP;

Zentaro Tamenaga, Sagamihara, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/155 (2006.01); B41J 29/02 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14427 (2013.01); B41J 2/155 (2013.01); B41J 29/02 (2013.01); B41J 2202/12 (2013.01); B41J 2202/20 (2013.01);
Abstract

A liquid ejection head includes, a first support member including a flow path for supplying liquid and an opening communicating with the flow path; at least one second support member that includes an individual liquid chamber communicating with the opening and arranged on the first support member along the flow path; and a recording element substrate including an energy-generating element for generating energy for ejecting the liquid, and a supply port for supplying the liquid to the energy-generating element, the supply port communicating with the individual liquid chamber, the recording element substrate being supported by a back surface of the second support member with respect to an opposite surface thereof facing the first support member. When P (μJ/pL) represents energy to be input per ejection liquid droplet volume in the energy-generating element, thermal resistance R (K/W) of a shortest heat transfer path of the second support member between the recording element substrate and the first support member satisfies:/}.


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