The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Apr. 25, 2013
Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Tomohiko Horikawa, Kyoto, JP;

Hideaki Hoki, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/335 (2006.01); B41J 2/345 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14129 (2013.01); B41J 2/1621 (2013.01); B41J 2/3351 (2013.01); B41J 2/3355 (2013.01); B41J 2/3357 (2013.01); B41J 2/3359 (2013.01); B41J 2/33545 (2013.01); B41J 2/345 (2013.01); B41J 2/3354 (2013.01); Y10T 29/49083 (2015.01);
Abstract

A thermal printhead includes a substrate, a resistor layer formed on the substrate, an electrode layer formed on the substrate and electrically connected to the resistor layer, and an insulating layer. The electrode layer includes a first electrically conductive portion and a second electrically conductive portion spaced apart from each other. The resistor layer includes a heater portion that bridges the first electrically conductive portion and the second electrically conductive portion as viewed in the thickness direction of the substrate. The insulating layer includes a portion positioned between the electrode layer and the heater portion. This arrangement reduces formation of a eutectic region between the heater portion and the electrode layer.


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