The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Apr. 28, 2011
Applicants:

Daisuke Hattori, Ibaraki, JP;

Takeshi Murashige, Ibaraki, JP;

Tadayuki Kameyama, Ibaraki, JP;

Inventors:

Daisuke Hattori, Ibaraki, JP;

Takeshi Murashige, Ibaraki, JP;

Tadayuki Kameyama, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C 1/17 (2006.01); B32B 17/06 (2006.01); B32B 7/06 (2006.01); B32B 17/10 (2006.01); B29C 65/00 (2006.01); B32B 38/00 (2006.01); G02F 1/1333 (2006.01); B32B 7/12 (2006.01); B29L 9/00 (2006.01); B29L 7/00 (2006.01); B29C 65/48 (2006.01); B29L 31/34 (2006.01); B32B 37/00 (2006.01); B32B 37/12 (2006.01); B32B 38/10 (2006.01); B32B 38/16 (2006.01);
U.S. Cl.
CPC ...
B32B 17/064 (2013.01); B29C 65/482 (2013.01); B29C 66/45 (2013.01); B29C 66/7392 (2013.01); B29C 66/7465 (2013.01); B29C 66/83421 (2013.01); B29C 66/83423 (2013.01); B29C 66/91431 (2013.01); B29C 66/91645 (2013.01); B29C 66/91921 (2013.01); B29C 66/944 (2013.01); B29C 66/949 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 17/10174 (2013.01); B32B 38/0036 (2013.01); G02F 1/133305 (2013.01); B29C 65/485 (2013.01); B29C 65/4835 (2013.01); B29C 66/7315 (2013.01); B29C 66/73111 (2013.01); B29C 66/73161 (2013.01); B29K 2995/0072 (2013.01); B29K 2995/0089 (2013.01); B29L 2007/002 (2013.01); B29L 2009/005 (2013.01); B29L 2031/3475 (2013.01); B32B 37/0007 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); B32B 2038/168 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/412 (2013.01); B32B 2307/538 (2013.01); B32B 2307/558 (2013.01); B32B 2307/72 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2315/08 (2013.01); B32B 2367/00 (2013.01); B32B 2398/20 (2013.01); B32B 2457/12 (2013.01); B32B 2457/20 (2013.01);
Abstract

There is provided a manufacturing method for a transparent substrate excellent in bending property, flexibility, impact resistance, and external appearance. A manufacturing method for a transparent substrate according to an embodiment of the present invention includes: a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to form an applied layer; a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition to form a laminate; a step C of subjecting the laminate to a first heat treatment to reduce an amount of a solvent remaining in the applied layer to a predetermined amount; and a step D including peeling the support backing from the laminate and subjecting the resultant to a second heat treatment to dry the applied layer, thereby forming a thermoplastic resin layer.


Find Patent Forward Citations

Loading…