The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Apr. 23, 2013
Applicant:

Brian D. Flinn, Seattle, WA (US);

Inventor:

Brian D. Flinn, Seattle, WA (US);

Assignee:

University of Washington, Seattle, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 38/10 (2006.01); B32B 7/06 (2006.01); B29C 65/00 (2006.01); B29C 70/00 (2006.01); B29C 59/02 (2006.01); B29C 65/48 (2006.01); C09J 5/00 (2006.01); C08J 5/18 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01);
U.S. Cl.
CPC ...
B32B 3/263 (2013.01); B29C 59/022 (2013.01); B29C 65/48 (2013.01); B29C 66/02 (2013.01); B29C 66/721 (2013.01); B29C 66/72141 (2013.01); B29C 66/72143 (2013.01); B29C 66/73755 (2013.01); B29C 70/00 (2013.01); B32B 5/02 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 7/06 (2013.01); B32B 38/10 (2013.01); C08J 5/18 (2013.01); C09J 5/00 (2013.01); B29C 59/025 (2013.01); B29C 66/02245 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/73161 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2262/106 (2013.01); Y10T 428/24364 (2015.01);
Abstract

A method of forming a composite material includes providing an uncured substrate. The method further includes applying a bond ply to the substrate and a peel ply to the bond ply. In some embodiments, the bond ply comprises a fiber veil, such as a glass fiber veil. The method further includes curing the substrate and removing the bond ply and peel ply from the cured substrate, thereby exposing an active surface on the substrate. Removing the bond ply and peel ply can create fractures in the active surface that increase the roughness and bondability of the active surface. In several embodiments, the composite materials described herein can be compatible with a wide range of adhesives, including room temperature adhesives.


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