The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jan. 21, 2009
Applicants:
Duk-yong Kim, Gyeonggi-do, KR;
Yoon-yong Kim, Gyeonggi-do, KR;
Hee-sung Go, Gyeonggi-do, KR;
Inventors:
Assignee:
KMW Inc., Hwasong-Kyonggi-Do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); H05K 3/0061 (2013.01); H05K 3/341 (2013.01); B23K 2201/42 (2013.01); H05K 3/3484 (2013.01); H05K 2201/0999 (2013.01); Y02P 70/613 (2015.11);
Abstract
Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.