The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Jan. 12, 2015
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Ravishankar Ajjanagadde Shivarama, Eden Prairie, MN (US);

Bradley J. Ver Meer, Savage, MN (US);

Razman Zambri, Eden Prairie, MN (US);

Assignee:

Seagate Technology LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 1/00 (2006.01); H05K 1/11 (2006.01); G11B 13/04 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); G11B 5/486 (2013.01); G11B 5/4866 (2013.01); G11B 13/04 (2013.01); H05K 1/0277 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01);
Abstract

A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.


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