The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Nov. 29, 2012
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 3/4038 (2013.01); H01L 2224/10 (2013.01); H05K 1/0237 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/09972 (2013.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract
Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.