The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
May. 02, 2013
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Jun Ishii, Osaka, JP;
Saori Kanazaki, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01); G11B 5/48 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); G11B 5/486 (2013.01); G11B 5/4853 (2013.01); G11B 5/4873 (2013.01); H05K 3/06 (2013.01); H05K 3/4007 (2013.01); G11B 5/484 (2013.01); H05K 1/189 (2013.01); H05K 3/321 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/053 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10083 (2013.01);
Abstract
A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.