The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Oct. 09, 2012
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jose A. Hajase, Austin, TX (US);

Nanju Na, Essex Junction, VT (US);

Nam H. Pham, Round Rock, TX (US);

Lloyd Walls, Austin, TX (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01); H01P 1/04 (2006.01); H01P 5/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H01P 1/047 (2013.01); H01P 5/028 (2013.01); H05K 1/115 (2013.01); H05K 2201/0187 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A printed circuit board is disclosed. The printed circuit board includes a first signal transmission layer, a via and a second signal transmission layer. The via connects the first signal transmission layer to the second signal transmission layer. The via includes a first region made of a first dielectric material having a first dielectric constant, and a second region made of a second dielectric material having a second dielectric constant lower than the first dielectric constant. The via allows AC Component of an electromagnetic signal to be transmitted from the first signal transmission layer to the second signal transmission layer while blocking any DC component of the electromagnetic signal.


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