The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Mar. 14, 2013
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Seung Wook Park, Suwon, KR;
Dong Hwan Lee, Suwon, KR;
Jin Gu Kim, Suwon, KR;
Chang Bae Lee, Suwon, KR;
Christian Romero, Suwon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.