The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Dec. 18, 2014
Applicant:

Silicon Laboratories Inc., Austin, TX (US);

Inventors:

John B. Youngblood, Austin, TX (US);

Guner Arslan, Austin, TX (US);

J. A. Bolton, Round Rock, TX (US);

Trenton J. Grale, Austin, TX (US);

Vitor Pereira, Austin, TX (US);

Jeffrey A. Tindle, Austin, TX (US);

David S. Trager, Buda, TX (US);

Yan Zhou, Austin, TX (US);

Assignee:

Silicon Laboratories Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/10 (2006.01); H04B 15/00 (2006.01);
U.S. Cl.
CPC ...
H04B 15/00 (2013.01);
Abstract

Die-to-die communication links for receiver integrated circuit dies within multi-die systems and related methods are disclosed for radio frequency (RF) receivers. The disclosed embodiments provide die-to-die communication links that allow for direct communication of operating parameters between receiver integrated circuit dies and other integrated circuit dies within a multi-die system so that the operation of receive path circuitry can be adjusted without requiring intervention from an external host processor integrated circuit. A variety of operating parameter information can be communicated through the die-to-die communication links so that the integrated circuit dies can quickly adjust to changing signal conditions without requiring intervention by the external host processor integrated circuit.


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