The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Feb. 21, 2013
Applicant:

National Instruments Corporation, Austin, TX (US);

Inventors:

Tamir Moran, Petaluma, CA (US);

Gregory S. Gonzales, Sebastopol, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 5/02 (2006.01); H01R 13/7197 (2011.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H03H 5/02 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01R 13/7197 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48229 (2013.01); Y10T 29/4913 (2015.01);
Abstract

In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.


Find Patent Forward Citations

Loading…