The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Jul. 04, 2014
Applicant:

Cheng Uei Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Dao Rui Sun, Dong-Guan, CN;

Gao Hua Du, Dong-Guan, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 24/62 (2011.01); H01R 13/6581 (2011.01); H01R 13/502 (2006.01); H01R 13/516 (2006.01); H01R 13/6591 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 24/62 (2013.01); H01R 13/502 (2013.01); H01R 13/6581 (2013.01); H01R 2107/00 (2013.01);
Abstract

A universal serial bus connector includes an insulating housing, a tongue board assembly disposed to a front of the insulating housing, a plurality of first and second conductive terminals, and a shielding shell. Each of the first conductive terminals has a base strip, a fastening strip, a contact portion and a soldering strip. The fastening strips are integrally molded to the tongue board assembly with contact portions thereof projecting under a bottom of the tongue board assembly. Each of the second conductive terminals has a touching portion and a soldering slice. Each of the soldering slices is soldered to a top surface of a portion of one of the first conductive terminals facing to a bottom surface of the soldering slice. The second conductive terminals are integrally molded to the tongue board assembly with the touching portions thereof projecting beyond a top of the tongue board assembly.


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