The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Oct. 18, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Syuichi Onodera, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); H01P 5/12 (2006.01); H03H 9/05 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01P 5/12 (2013.01); H03H 9/0566 (2013.01); H04M 1/0202 (2013.01); H05K 1/0227 (2013.01); H05K 1/0233 (2013.01); H05K 1/0243 (2013.01); H05K 1/113 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/1006 (2013.01);
Abstract

In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode flows into via conductors that are connected along an edge portion of the ground electrode close to the transmission electrode and connected to a ground line of a motherboard. Therefore, the transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along an edge portion of the ground electrode toward a reception electrode side. Thus, characteristics of isolation between the transmission electrode and the reception electrode provided on the mounting substrate on which the splitter is mounted are improved.


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