The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Jun. 28, 2011
Applicants:
Rémi Manouk Anémian, Seoul, KR;
Bernd Schröder, Villmar-Weyer, DE;
Claire DE Nonencourt, Frankfurt am Main, DE;
Inventors:
Rémi Manouk Anémian, Seoul, KR;
Bernd Schröder, Villmar-Weyer, DE;
Claire De Nonencourt, Frankfurt am Main, DE;
Assignee:
Merck Patent GmbH, Darmstadt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A01N 55/02 (2006.01); A61K 31/555 (2006.01); C07F 15/00 (2006.01); H01L 51/00 (2006.01); A61K 31/4709 (2006.01); C07D 209/56 (2006.01); C07D 209/82 (2006.01); C07D 219/00 (2006.01); C07D 223/22 (2006.01); C07D 265/38 (2006.01); C07D 279/18 (2006.01); C07D 413/14 (2006.01); C07D 417/04 (2006.01); C07D 487/04 (2006.01); C07D 491/04 (2006.01); C07D 493/04 (2006.01); C07D 495/04 (2006.01); C09K 11/06 (2006.01); H05B 33/00 (2006.01); H05B 33/14 (2006.01); H01L 51/50 (2006.01); A61N 5/06 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0072 (2013.01); A61K 31/4709 (2013.01); C07D 209/56 (2013.01); C07D 209/82 (2013.01); C07D 219/00 (2013.01); C07D 223/22 (2013.01); C07D 265/38 (2013.01); C07D 279/18 (2013.01); C07D 413/14 (2013.01); C07D 417/04 (2013.01); C07D 487/04 (2013.01); C07D 491/04 (2013.01); C07D 493/04 (2013.01); C07D 495/04 (2013.01); C07F 15/00 (2013.01); C07F 15/0033 (2013.01); C09K 11/06 (2013.01); H01L 51/00 (2013.01); H01L 51/0073 (2013.01); H01L 51/0074 (2013.01); H01L 51/0085 (2013.01); H05B 33/00 (2013.01); H05B 33/14 (2013.01); A61N 5/0616 (2013.01); A61N 5/0624 (2013.01); A61N 2005/0653 (2013.01); C09K 2211/104 (2013.01); C09K 2211/1029 (2013.01); C09K 2211/1037 (2013.01); C09K 2211/1044 (2013.01); C09K 2211/1059 (2013.01); C09K 2211/1088 (2013.01); C09K 2211/1092 (2013.01); C09K 2211/185 (2013.01); H01L 51/0067 (2013.01); H01L 51/5016 (2013.01); Y02E 10/549 (2013.01);
Abstract
The present invention relates, inter alia, to metal complexes having improved solubility, to processes for the preparation of the metal complexes, to devices comprising these metal complexes and to the use of the metal complexes. M(L)n(L')m formula 1 where the compound contains a moiety M(L)n of the formula (2) W is equal to the formula (3).