The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Apr. 12, 2012
Thomas Kippes, Neumarkt, DE;
Stephan Haslbeck, Wiesent, DE;
Annaniah Luruthudass, Penang, MY;
EE Lian Lee, Georgetown, MY;
Thomas Kippes, Neumarkt, DE;
Stephan Haslbeck, Wiesent, DE;
Annaniah Luruthudass, Penang, MY;
Ee Lian Lee, Georgetown, MY;
OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;
Abstract
The invention relates to a structural component which comprises a support (), an optoelectronic semiconductor chip () having at least one lateral face (), further comprising a connecting means (), a first molded element (), and a second molded element (), the optoelectronic semiconductor chip () being mechanically connected to the support () by the connecting means (). The first molded element () covers an exposed outer face of the optoelectronic semiconductor chip () and the first molded element () covers an exposed outer face of the connecting means (). The second molded element () covers an exposed outer face of the first molded element () and the second molded element () has a higher modulus of elasticity at room temperature than the first molded element.