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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9252341 B1

PDFFull Text
Date of Patent:
Feb. 02, 2016

Filed:

Feb. 09, 2015

Optoelectronic chip-on-board module

Applicant:

Heraeus Noblelight Gmbh, Hanau, DE;

Inventors:

Michael Peil, Otzberg, DE;

Florin Oswald, Frankfurt am Main, DE;

Harald Maiweg, Korschenbroich, DE;

Assignee:

Heraeus Noblelight GmbH, Hanau, DE;

Attorney:

Panitch Schwarze Belisario & Nadel LLP

Primary Examiner:

Khaja Ahmad

Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 31/0203 (2014.01); H01L 21/56 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 33/56 (2010.01); H05K 3/28 (2006.01); H01L 31/0232 (2014.01); H01L 27/144 (2006.01); H01L 27/15 (2006.01); F21K 99/00 (2010.01); F21Y 101/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 21/56 (2013.01); H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 27/1446 (2013.01); H01L 27/15 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01); H01L 33/56 (2013.01); H05K 3/284 (2013.01); F21K 9/90 (2013.01); F21Y 2101/02 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H05K 1/0274 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/09909 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0126 (2013.01);
Abstract

A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

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