The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Jan. 18, 2011
Randall D. Briggs, Boise, ID (US);
Randall D. Briggs, Boise, ID (US);
Marvell International Ltd., Hamilton, BM;
Abstract
Method, algorithms, architectures, packages, circuits, and/or approaches for relatively low cost packaged integrated circuits (e.g., ball grid array or BGA packages) are disclosed. For example, a packaged integrated circuit can include a first chip, the first chip including a plurality of bond pads; a plurality of bond pad connectors in electrical communication with the plurality of bond pads; a substrate having a plurality of layers, at least one of the plurality of layers being configured to electrically connect the plurality of bond pad connectors and a plurality of external package connections; and a redistribution layer on the first chip, wherein the redistribution layer is configured to electrically connect at least one of the plurality of bond pad connectors and at least one of the plurality of bond pads on the first chip.