The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Nov. 02, 2010
Applicant:
Sou Hoshi, Miura, JP;
Inventor:
Sou Hoshi, Miura, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/535 (2006.01); H01L 23/50 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/49844 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 23/535 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01);
Abstract
A semiconductor apparatus includes a multilayer interposer substrate including a power layer as an inner layer; a plurality of connection terminals provided on one surface of the interposer substrate; and a semiconductor chip mounted on the other surface of the interposer substrate. Among power terminals, ground terminals, and signal terminals provided in the semiconductor apparatus, all the power terminals are arranged in one power area and the power area includes only the power terminals.