The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Jul. 25, 2013
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/053 (2006.01); H01L 21/56 (2006.01); H01L 23/13 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/563 (2013.01); H01L 23/053 (2013.01); H01L 23/13 (2013.01); H01L 23/3735 (2013.01); H01L 23/49833 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 23/24 (2013.01); H01L 24/83 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06152 (2013.01); H01L 2224/06154 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14152 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/3224 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15151 (2013.01);
Abstract
An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.