The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9252086 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 02, 2016

Filed:

Dec. 06, 2012
Applicant:

Fuji Electric Co., Ltd, Kawasaki-shi, Kanagawa-ken, JP;

Inventor:

Atsushi Maruyama, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/02 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 2224/3701 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/40249 (2013.01); H01L 2224/40257 (2013.01); H01L 2224/41109 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); Y10T 83/0207 (2015.04);
Abstract

A connector for electrically connecting a chip electrode of a semiconductor element to a lead constituting an external leading terminal of the chip electrode, includes a first connecting part having an interface joined to the chip electrode; a second connecting part having an interface joined to a base end part of the lead; and a plate-shape coupling part for connecting the first connecting part and the second connecting part to each other, and having a step formed on the interface of the first connecting part in a direction away from the chip electrode by a half blanking process.


Find Patent Forward Citations

Maruyama, Atsushi. (2016). Connector and resin-sealed semiconductor device (U.S. Patent No. 9252086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9252086

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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