The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Aug. 29, 2014
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Yao-Jun Tsai, Taoyuan County, TW;
Chen-Peng Hsu, Hsinchu, TW;
Shih-Yi Wen, Taipei, TW;
Chi-Chin Yang, Hsinchu, TW;
Hung-Lieh Hu, Hsinchu, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/00 (2006.01); H01L 23/48 (2006.01); H01L 21/306 (2006.01); H01L 27/02 (2006.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/34 (2006.01); G02B 6/12 (2006.01); G02B 6/34 (2006.01); H01L 29/861 (2006.01); H01L 23/60 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G02B 6/12 (2013.01); G02B 6/34 (2013.01); H01L 21/30604 (2013.01); H01L 21/76898 (2013.01); H01L 23/60 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 27/0255 (2013.01); H01L 29/861 (2013.01); H01L 33/20 (2013.01); H01L 33/62 (2013.01); H01S 5/026 (2013.01); H01S 5/0208 (2013.01); H01S 5/02469 (2013.01); H01S 5/34 (2013.01); G02B 2006/12061 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/80 (2013.01); H01L 25/167 (2013.01); H01L 2224/04 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48148 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1434 (2013.01); H01L 2933/0066 (2013.01);
Abstract
Provided is a substrate, including a substrate material, two conductive structures, and at least one diode. The two conductive structures extend from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material. The at least one diode is embedded in the substrate material at a sidewall of one of the through holes.