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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9252079 B1

PDFFull Text
Date of Patent:
Feb. 02, 2016

Filed:

Aug. 29, 2014

Substrate, method of fabricating the same, and application the same

Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Yao-Jun Tsai, Taoyuan County, TW;

Chen-Peng Hsu, Hsinchu, TW;

Shih-Yi Wen, Taipei, TW;

Chi-Chin Yang, Hsinchu, TW;

Hung-Lieh Hu, Hsinchu, TW;

Assignee:

Industrial Technology Research Institute, Hsinchu, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Nikolay Yushin

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/00 (2006.01); H01L 23/48 (2006.01); H01L 21/306 (2006.01); H01L 27/02 (2006.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/34 (2006.01); G02B 6/12 (2006.01); G02B 6/34 (2006.01); H01L 29/861 (2006.01); H01L 23/60 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G02B 6/12 (2013.01); G02B 6/34 (2013.01); H01L 21/30604 (2013.01); H01L 21/76898 (2013.01); H01L 23/60 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 27/0255 (2013.01); H01L 29/861 (2013.01); H01L 33/20 (2013.01); H01L 33/62 (2013.01); H01S 5/026 (2013.01); H01S 5/0208 (2013.01); H01S 5/02469 (2013.01); H01S 5/34 (2013.01); G02B 2006/12061 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/80 (2013.01); H01L 25/167 (2013.01); H01L 2224/04 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48148 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1434 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Provided is a substrate, including a substrate material, two conductive structures, and at least one diode. The two conductive structures extend from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material. The at least one diode is embedded in the substrate material at a sidewall of one of the through holes.

Find Patent Forward Citations

Tsai, Yao-Jun. (2016). Substrate, method of fabricating the same, and application the same (U.S. Patent No. 9252079). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9252079

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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