The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Dec. 04, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2006.01); H01L 23/473 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/46 (2013.01); H01L 23/473 (2013.01); H01L 23/49827 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/3011 (2013.01);
Abstract
An assembly includes a chip including an integrated circuit, a casing including an integrated circuit including plural active elements and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.