The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Mar. 07, 2014
Applicant:

Inpaq Technology Co., Ltd., Miaoli, TW;

Inventors:

Yu Chia Chang, Taichung, TW;

Chi Long Lin, Hsinchu County, TW;

Huai Luh Chang, Miaoli County, TW;

Cheng Yi Wang, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 41/14 (2006.01); H01F 41/22 (2006.01); H01F 27/255 (2006.01); H03H 7/42 (2006.01); H01F 17/00 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01F 41/04 (2013.01); H01F 17/0013 (2013.01); H01F 27/255 (2013.01); H01F 41/046 (2013.01); H01F 41/14 (2013.01); H01F 41/22 (2013.01); H03H 7/427 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0073 (2013.01); H03H 2001/0085 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49069 (2015.01); Y10T 29/49073 (2015.01); Y10T 29/49078 (2015.01);
Abstract

A method of manufacturing common mode filter having heterogeneous laminates, the method includes steps of providing a nonmagnetic insulating substrate; forming a magnetic layer; forming a first lead; forming a first insulating layer; forming a first through hole; forming a first coil; forming a second insulating layer; forming a second coil; forming a third insulating layer; forming a second through hole; forming a second lead; forming a fourth insulating layer; and depositing a first magnetic material.


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