The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Apr. 27, 2012
Applicant:

Hiroyuki Ishigaki, Komaki, JP;

Inventor:

Hiroyuki Ishigaki, Komaki, JP;

Assignee:

CKD Corporation, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 7/18 (2006.01); G01N 21/956 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G01N 21/95684 (2013.01); G01N 2021/95638 (2013.01); H05K 3/3436 (2013.01); H05K 3/3484 (2013.01);
Abstract

A board inspection apparatus includes an irradiation unit, an imaging unit, and an image processing unit. The image processing unit includes a three-dimensional measurement unit configured to perform three-dimensional measurement of the surfaces of the solder and the resist film by a certain three-dimensional measurement method based on the image data, a virtual standard surface setting unit configured to set a virtual standard surface corresponding to a contacting surface of a certain component mounted in a certain area of the printed board, a protrusion amount calculation unit configured to calculate a protrusion amount from the virtual standard surface for each solder printed and formed in the certain area, and a determination unit configured to determine whether the printed state of the solder passes or fails based on each of the protrusion amounts of the solder.


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