The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Feb. 24, 2015
Applicant:
Enthone Inc., West Haven, CT (US);
Inventors:
Franz-Josef Stark, Zulpich, DE;
Christoph Werner, Dusseldorf, DE;
Assignee:
Enthone Inc., West Haven, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/34 (2006.01); C23C 18/36 (2006.01); C23C 18/40 (2006.01); C23C 18/44 (2006.01); C23C 18/50 (2006.01); C07C 229/08 (2006.01); C07C 229/12 (2006.01); C07C 229/16 (2006.01); C07C 229/22 (2006.01); C07C 237/06 (2006.01); C07C 309/14 (2006.01); C23C 18/16 (2006.01); C23C 18/31 (2006.01); C23C 18/32 (2006.01); C23C 18/38 (2006.01); C23C 18/42 (2006.01); C23C 18/48 (2006.01);
U.S. Cl.
CPC ...
C23C 18/44 (2013.01); C07C 229/08 (2013.01); C07C 229/12 (2013.01); C07C 229/16 (2013.01); C07C 229/22 (2013.01); C07C 237/06 (2013.01); C07C 309/14 (2013.01); C23C 18/1601 (2013.01); C23C 18/31 (2013.01); C23C 18/32 (2013.01); C23C 18/34 (2013.01); C23C 18/36 (2013.01); C23C 18/38 (2013.01); C23C 18/40 (2013.01); C23C 18/42 (2013.01); C23C 18/48 (2013.01); C23C 18/50 (2013.01);
Abstract
A plating formulation for the electroless deposition of a metal layer on a substrate, wherein a β-amino acid and/or β-amino acid derivative is used as a stabilizer. The β-amino acid is present within a range of 1 mg/L to 2 g/L. Typically, the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5. The inventive plating formulation can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid.