The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Apr. 04, 2014
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/14 (2006.01); C09J 9/02 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C09J 163/00 (2006.01); H01C 7/02 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08K 3/04 (2013.01); C08K 3/08 (2013.01); C09J 163/00 (2013.01); H01C 1/1406 (2013.01); H01C 7/027 (2013.01); C08K 2003/085 (2013.01); H01C 7/028 (2013.01);
Abstract
The subject matter of the present application is a curable adhesive composition having PTC characteristics after curing, containing (i) a reactive binder system, based on an epoxy-resin-component and a curing agent-component, (ii) particles of a carbon modification in a range of 0.01 wt % to 15.0 wt %, based on the total weight of the curable adhesive composition, and (iii) copper powder in a range of 0.5 wt % to 5.0 wt %, based on the total weight of the curable adhesive composition, wherein the reactive binder system comprises>70 wt % of all organic polymers of the adhesive composition.