The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Aug. 11, 2014
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Min Jin Ko, Daejeon, KR;
Kyung Mi Kim, Daejeon, KR;
Young Ju Park, Daejeon, KR;
Jae Ho Jung, Daejeon, KR;
Min A Yu, Daejeon, KR;
Min Kyoun Kim, Daejeon, KR;
Assignee:
LG Chem, Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 19/00 (2006.01); C08L 83/04 (2006.01); C08G 77/04 (2006.01); H01L 23/29 (2006.01); G02F 1/1335 (2006.01); H01L 33/58 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08G 77/04 (2013.01); G02F 1/133603 (2013.01); H01L 23/296 (2013.01); H01L 33/58 (2013.01); C08L 2203/206 (2013.01); H01L 33/56 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/1068 (2015.01);
Abstract
Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.