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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9249296 B1

PDFFull Text
Date of Patent:
Feb. 02, 2016

Filed:

Aug. 17, 2011

Integrated molded product

Applicant:

Kouichi Sakata, Fuji, JP;

Inventor:

Kouichi Sakata, Fuji, JP;

Assignee:

POLYPLASTICS CO., LTD., Toyko, JP;

Attorney:

Knobbe Martens Olson & Bear LLP

Primary Examiner:

Vivian Chen

Int. Cl.
CPC ...
B32B 7/04 (2006.01); B32B 7/12 (2006.01); B32B 25/04 (2006.01); B32B 25/08 (2006.01); B32B 25/20 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); C08L 67/02 (2006.01); C08L 67/03 (2006.01); C08L 83/04 (2006.01); C09J 183/04 (2006.01); C08K 3/32 (2006.01); C08K 5/49 (2006.01); C08K 5/51 (2006.01); C08K 5/52 (2006.01); C08K 5/521 (2006.01); C08K 5/524 (2006.01); C08K 5/53 (2006.01); C08K 5/5313 (2006.01); C08K 5/5317 (2006.01); C08K 5/5333 (2006.01); C08J 5/12 (2006.01); C08K 3/00 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C08L 67/02 (2013.01); C08J 5/128 (2013.01); C08K 5/5313 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 25/04 (2013.01); B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/28 (2013.01); B32B 27/283 (2013.01); B32B 27/36 (2013.01); B32B 2250/03 (2013.01); B32B 2307/3065 (2013.01); B32B 2367/00 (2013.01); B32B 2383/00 (2013.01); C08J 2367/02 (2013.01); C08J 2367/04 (2013.01); C08J 2383/04 (2013.01); C08K 3/0008 (2013.01); C08K 3/0041 (2013.01); C08K 3/0058 (2013.01); C08K 3/32 (2013.01); C08K 5/005 (2013.01); C08K 5/0008 (2013.01); C08K 5/0066 (2013.01); C08K 5/0091 (2013.01); C08K 5/49 (2013.01); C08K 5/51 (2013.01); C08K 5/52 (2013.01); C08K 5/521 (2013.01); C08K 5/524 (2013.01); C08K 5/53 (2013.01); C08K 5/5317 (2013.01); C08K 5/5333 (2013.01); C08K 2003/321 (2013.01); C08K 2003/324 (2013.01); C08K 2003/325 (2013.01); C08K 2003/326 (2013.01); C08K 2003/329 (2013.01); C08L 67/03 (2013.01); C08L 83/04 (2013.01); C08L 2201/02 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01); C09J 183/04 (2013.01); Y10T 428/31786 (2015.04);
Abstract

To provide a technique in which a phosphorus compound does not inhibit curing of an addition reaction type silicone-based composition even though the addition reaction type silicone-based composition is in contact with a resin molded product containing the phosphorus compound. An integrated molded product including a thermoplastic resin molded product containing a phosphorus compound, an addition reaction type silicone-based composition, and a member, in which: the thermoplastic resin molded product is in contact with the addition reaction type silicone-based composition; and a pentavalent phosphorus compound is used as the phosphorus compound. The thermoplastic resin molded product preferably contains a polybutylene terephthalate resin in light of heat resistance.

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