The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Nov. 29, 2012
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Nobuyuki Hamakura, Yuzawa, JP;
Hidefumi Nakamura, Hachinohe, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09B 67/00 (2006.01); C22C 29/00 (2006.01); C08L 59/00 (2006.01);
U.S. Cl.
CPC ...
C08L 59/00 (2013.01);
Abstract
A composition for injection molding includes: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin and an ethylene-glycidyl methacrylate-based copolymer. In the composition, the ethylene-glycidyl methacrylate-based copolymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the amount of the polyacetal-based resin.
Hamakura, Nobuyuki. (2016). Composition for injection molding, sintered compact, and method for producing sintered compact (U.S. Patent No. 9249292). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9249292
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile