The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Apr. 15, 2015
Applicant:

Cytec Technology Corp., Wilmington, DE (US);

Inventor:

Jonathan E. Meegan, Chester, GB;

Assignee:

Cytec Technology Corp., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08G 59/38 (2006.01); C08G 59/50 (2006.01); C08K 7/06 (2006.01); C08G 65/22 (2006.01); D06M 17/04 (2006.01); C08G 85/00 (2006.01); C08G 59/56 (2006.01); B29C 70/48 (2006.01); C08G 59/00 (2006.01); C08J 3/24 (2006.01); B29C 45/02 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); B29K 63/00 (2006.01); B29K 105/08 (2006.01);
U.S. Cl.
CPC ...
C08K 7/06 (2013.01); B29C 70/48 (2013.01); C08G 59/00 (2013.01); C08G 59/38 (2013.01); C08G 59/50 (2013.01); C08G 59/504 (2013.01); C08G 59/5026 (2013.01); C08G 59/56 (2013.01); C08G 65/22 (2013.01); C08G 85/00 (2013.01); C08J 3/243 (2013.01); C08J 3/244 (2013.01); C08L 63/00 (2013.01); D06M 17/04 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0809 (2013.01); C08J 2363/00 (2013.01); Y10T 428/24994 (2015.04); Y10T 428/31511 (2015.04);
Abstract

Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.


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