The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Sep. 04, 2012
Applicants:

Kyuhei Kitao, Himeji, JP;

Hideyuki Takai, Himeji, JP;

Michihiro Sugahara, Himeji, JP;

Inventors:

Kyuhei Kitao, Himeji, JP;

Hideyuki Takai, Himeji, JP;

Michihiro Sugahara, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/32 (2006.01); C08G 59/34 (2006.01); C07D 301/14 (2006.01); C07D 303/12 (2006.01); C08G 59/02 (2006.01); C07D 303/04 (2006.01); C08L 63/00 (2006.01); C07C 2/76 (2006.01); C07C 6/04 (2006.01);
U.S. Cl.
CPC ...
C08G 59/3218 (2013.01); C07C 2/76 (2013.01); C07C 6/04 (2013.01); C07D 301/14 (2013.01); C07D 303/04 (2013.01); C07D 303/12 (2013.01); C08G 59/02 (2013.01); C08L 63/00 (2013.01); C07C 2101/16 (2013.01);
Abstract

Provided are: a novel triepoxy compound capable of forming, through polymerization, a cured article having excellent heat resistance; a production method thereof; a curable composition including the triepoxy compound; and a cured article obtained by curing the curable composition. The triepoxy compound according to the present invention is represented by Formula (1). The triepoxy compound represented by Formula (1) may be obtained typically by oxidizing a compound represented by Formula (2) with an oxidizing agent. In Formulae (1) and (2), Rto R° are the same as or different from one another and each represent hydrogen atom, methyl group, or ethyl group. Formulae (1) and (2) are expressed as follows:


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