IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9248786 B1

PDFFull Text
Date of Patent:
Feb. 02, 2016

Filed:

Jun. 28, 2010

Board structure for vehicle and manufacturing method of the same

Applicants:

Kiichiro Suzuki, Nagoya, JP;

Takaaki Sugita, Nagoya, JP;

Inventors:

Kiichiro Suzuki, Nagoya, JP;

Takaaki Sugita, Nagoya, JP;

Assignee:

HAYASHI ENGINEERING, Nagoya, JP;

Attorney:

Knobbe Martens Olson & Bear LLP

Primary Examiner:

David Sample

Assistant Examiner:

Nicholas W Jordan

Int. Cl.
CPC ...
B32B 3/12 (2006.01); B60R 13/00 (2006.01); B60R 13/01 (2006.01); B29C 70/46 (2006.01); B29D 99/00 (2010.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 27/12 (2006.01); B32B 3/28 (2006.01); B29C 44/12 (2006.01); B29C 44/18 (2006.01); B29C 37/00 (2006.01); B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
B60R 13/013 (2013.01); B29C 44/128 (2013.01); B29C 44/1209 (2013.01); B29C 44/1228 (2013.01); B29C 44/18 (2013.01); B29C 70/46 (2013.01); B29D 99/0021 (2013.01); B32B 3/12 (2013.01); B32B 3/28 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 27/12 (2013.01); B29C 37/0057 (2013.01); B29C 2043/022 (2013.01); B32B 2260/023 (2013.01); B32B 2262/0284 (2013.01); B32B 2262/06 (2013.01); B32B 2307/718 (2013.01); B32B 2605/00 (2013.01); Y10T 428/24149 (2015.01);
Abstract

Provided is a board structure for a vehicle, which includes a durable hinge portion while light weight and high rigidity of the board structure are maintained. The board structure includes: hinge portionformed by squashing a part of honeycomb structurethat is charged with thermosetting resinthe from back side surface memberside toward front side surface member, in which front side surface memberand back side surface memberare joined to each other, and flexible hinge sheetprovided on the outer side of front side surface memberacross hinge portion. At least a part of hinge sheetin a thickness direction thereof is embedded in front side surface member

Find Patent Forward Citations

Loading…