The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Aug. 04, 2009
Applicants:

Winfried Hoffmuller, Bad Tolz, DE;

Patrick Renner, Reichersbeuern, DE;

Manfred Heim, Bad Tolz, DE;

Theodor Burchard, Gmund, DE;

Inventors:

Winfried Hoffmuller, Bad Tolz, DE;

Patrick Renner, Reichersbeuern, DE;

Manfred Heim, Bad Tolz, DE;

Theodor Burchard, Gmund, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B42D 25/43 (2014.01); B42D 25/324 (2014.01); B42D 25/445 (2014.01); B42D 25/29 (2014.01); B42D 25/328 (2014.01); B42D 25/47 (2014.01);
U.S. Cl.
CPC ...
B42D 25/43 (2014.10); B42D 25/29 (2014.10); B42D 25/324 (2014.10); B42D 25/445 (2014.10); B32B 2425/00 (2013.01); B42D 25/328 (2014.10); B42D 25/47 (2014.10); B42D 2033/18 (2013.01); B42D 2035/16 (2013.01); B42D 2035/36 (2013.01); Y10T 156/17 (2015.01);
Abstract

The present invention relates to a method for producing a security element (), to a security element () obtainable by the method according to the invention, to transfer materials having the security elements according to the invention, and to objects of value secured with the security elements according to the invention. The security element () according to the invention has two functional layers () which are bonded together by means of a resist layer (). The resist layer () has a pattern which is employed to generate a congruent pattern in the first functional layer (). Then the pattern of the resist layer (), and thus also of the first functional layer (), is exactly reproduced in the second functional layer (). This is achieved by bonding the second functional layer () in the form of the pattern of the resist layer (). The non-bonded areas of the second functional layer () are removed, thereby forming negative writing.


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