The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Jul. 09, 2014
Canon Kabushiki Kaisha, Tokyo, JP;
Shuzo Iwanaga, Kawasaki, JP;
Zentaro Tamenaga, Sagamihara, JP;
Kazuhiro Yamada, Yokohama, JP;
Takuto Moriguchi, Kamakura, JP;
Takatsugu Moriya, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A liquid ejection head includes an electrical wiring substrate and a printing element substrate, wherein the position variation of the printing element substrate due to curing of a sealing agent is eliminated. Specifically, a gap between two support members is covered with the electrical wiring substrate so as to be able to prevent a sealing agent from flowing into the gap. As a result, even in the case where the size of the gap varies due to the variation in the dimensional accuracy and/or the variation in the assembly accuracy, the sealing agent will not enter this gap, and therefore the shape thereof can be made substantially uniform regardless of the positions. This results in a substantially uniform stress in curing and contracting of the sealing agent, and the variation in the mounting position of the printing element substrate can be suppressed.