The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Dec. 13, 2013
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chang Yi Chen, Hsinchu, TW;

Yung Min Hsieh, Hsinchu County, TW;

Chang Ho Liou, Changhua County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/06 (2006.01); H05K 3/36 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/361 (2013.01); H05K 1/0289 (2013.01); H05K 3/323 (2013.01); H05K 2201/0367 (2013.01);
Abstract

A flexible electronic component module includes a first substrate and a second substrate. The first substrate overlaps the second substrate to define at least one first exposed portion and at least one second exposed portion. The at least one first exposed portion includes a first electrode layer and the at least one second exposed portion includes a second electrode layer. The first electrode layer is disposed on a lower surface of the first substrate and the second electronic layer is disposed on an upper surface of the second substrate.


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