The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9247636 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 26, 2016

Filed:

Mar. 12, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mark K. Hoffmeyer, Rochester, MN (US);

Amanda E. Mikhail, Rochester, MN (US);

Arvind K. Sinha, Rochester, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 19/00 (2011.01); H01L 21/66 (2006.01); G01R 31/26 (2014.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); G06F 17/5068 (2013.01); G06F 17/5072 (2013.01); G06F 17/5081 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); G01R 31/26 (2013.01); G06F 2217/12 (2013.01); G06F 2217/14 (2013.01); G06F 2217/38 (2013.01); G06F 2217/40 (2013.01); G06F 2217/80 (2013.01); H05K 3/3494 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.


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