The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Mar. 13, 2013
Applicant:

Wistron Corporation, New Taipei, TW;

Inventors:

Jui-Kai Cheng, New Taipei, TW;

Chien-Chih Yu, New Taipei, TW;

Assignee:

WISTRON CORPORATION, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 2/20 (2006.01); H01R 13/24 (2006.01); H01R 4/48 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01M 2/204 (2013.01); H01R 4/48 (2013.01); H01R 12/716 (2013.01); H01R 13/24 (2013.01);
Abstract

An electrical connection assembly is provided to electrically connect with at least one electrical contact of an electronic apparatus. The electrical connection assembly includes an insulating casing, a circuit board and a resilient conductive element. An inner space is defined in the insulating casing, and at least one opening is defined on the insulating casing for communicating the inner space and the exterior of the insulating casing. The circuit board is disposed in the inner space of the insulating casing. The resilient conductive element includes a connecting side for fixing on and electrically connecting with the circuit board. The resilient conductive element further includes a compressible side for facing the opening and being exposed therethrough. The thickness of the resilient conductive element is reduced when an external force is applied thereon and recovers when the external force is removed.


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