The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Mar. 14, 2012
Applicants:

Jinmin LI, Beijing, CN;

Hua Yang, Beijing, CN;

Xiaoyan Yi, Beijing, CN;

Junxi Wang, Beijing, CN;

Inventors:

Jinmin Li, Beijing, CN;

Hua Yang, Beijing, CN;

Xiaoyan Yi, Beijing, CN;

Junxi Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/15 (2006.01); H01L 29/22 (2006.01); H01L 33/06 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/06 (2013.01); H01L 24/24 (2013.01); H01L 33/007 (2013.01); H01L 33/0095 (2013.01); H01L 33/382 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/385 (2013.01); H01L 2924/12041 (2013.01);
Abstract

The present disclosure relates to a light emitting diode packaging structure and the method of manufacturing the same. The light emitting diode packaging structure has an insulating substrate with through holes formed on each side of the upper surface thereof, the through hole being filled with conductive metal. Additionally, a n-type layer, an active layer, a p-type layer, an insulating layer and a p-type electrode are formed on the insulating substrate. The structure further may include a n-type electrode provided on a side of the upper surface of the n-type layer; a first back electrode provided at one side of the back surface of the insulating substrate; a second back electrode provided at the other side of back surface of the insulating substrate; and an optical element packaged on the base substrate.


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