The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Aug. 21, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Toshio Fukuda, Kanagawa, JP;
Yui Ishii, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 21/00 (2006.01); H01L 29/786 (2006.01); H01L 27/32 (2006.01); H01L 27/12 (2006.01); H01L 51/00 (2006.01); H01L 29/66 (2006.01); G02F 1/167 (2006.01); H01L 51/05 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78606 (2013.01); H01L 27/1214 (2013.01); H01L 27/3262 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); G02F 1/1368 (2013.01); G02F 1/167 (2013.01); G02F 2202/02 (2013.01); H01L 27/3244 (2013.01); H01L 29/66757 (2013.01); H01L 51/0512 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01); Y02E 10/549 (2013.01);
Abstract
There is provided a method of manufacturing a thin-film device, the method including forming a first substrate on a supporting base by a coating method, the first substrate being formed by using a resin material; forming a second substrate on the first substrate by using any one of a thermosetting resin and energy ray-curable resin; forming an active element on the second substrate; and removing the supporting base from the first substrate. The resin material used to form the first substrate has a glass transition temperature of at least 180° C.