The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Nov. 25, 2014
Applicant:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Inventors:

Olivier Le-Briz, Saint-Gervais, FR;

Romain Coffy, Voiron, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01);
Abstract

An electronic device is formed by a stack of an integrated circuit chip and an optical plate. The integrated circuit chip includes integrated circuits (such as optical circuits) formed on or in a semiconductor substrate plate. The optical integrated circuits may form an optical sensor. An electrical connection network is provided on the top side of the semiconductor substrate plate. Electrical connection lugs, which are connected to the electrical connection network through electrical connection vias, are mounted on the back side of the semiconductor substrate plate. The vias are through silicon vias situated at a distance from the periphery of the semiconductor substrate plate. The optical plate is configured to allow light radiation to pass to the optical integrated circuits.


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